garyhuang1963

178 Flips | 5 Magazines | 10 Likes | 1 Follower | @garyhuang1963 | Keep up with garyhuang1963 on Flipboard, a place to see the stories, photos, and updates that matter to you. Flipboard creates a personalized magazine full of everything, from world news to life’s great moments. Download Flipboard for free and search for “garyhuang1963”

Windows on Snapdragon 讓 PC 跟網路連接更緊密

別擔心,這次應該不會是 Windows RT 的重演。<p>Surface 的上海發表會後,微軟這次的亞洲之行並沒有結束,來到台北的 Computex 2017 上,他們又跟高通一起,推廣起了「Always Connected PC」的概念。簡單來說,兩者準備一起推出時刻連網、續航出色並且還便於攜帶的產品,於微軟而言,這就意味著 Windows 將會出現在更多的地方。<p>Gallery: Qualcomm Always Connected PC platform | 9 Photos<p>9<p>在這次的活動中,兩家公司公佈了更多為 Windows 10 而設的 Snapdragon 晶片細節。原來,被選中的方案就 …

傳承繁體字型之美,日星鑄字銅模修復計畫啟動

希望集你我之力,儘速在 5 年內將字型修復建檔。<p>「只要還有印刷廠會用到活版印刷,日星鑄字就會繼續營業」這是老闆張介冠,維持的台灣僅存最後一家仍在營運的鑄字行,對於屬於台灣的鉛字字型之美的技術乃至於美學傳承的最後堅持。而現在,已經 60 歲的張老闆看著手邊的字體銅模,很可能因為歷經數十年的反覆鑄造的不同程度損傷,而就此隨著活版印刷技術而逝,讓流傳千年的活版印刷自此面臨無字可印的結果。所以希望能透過近期興起的集資計畫,來讓這套屬於日星鑄字行特有的活版印刷字型能夠藉由現代的技術予以保留。也因此在台灣貝殼放大集資團隊的幫助之下,正式於今日啟動了日星鑄字行的「字體銅模修復計畫」。<p>其實日星鑄字行在台灣還算 …

Bluetooth SIG adopts Bluetooth 5 with 4X rage and 2X speed, devices due within 2 to 6 months

The Bluetooth Special Interest Group officially ratified the Bluetooth 5 standard on Wednesday, meaning Apple's next iPhone and iPad models could …

Why EUV Is So Difficult

Xilinx Virtex UltraScale+ FPGAs incorporate 32 or 64Gbits of HBM, delivers 20x more memory bandwidth than DDR

Today, Xilinx announced four members of a new Virtex UltraScale+ HBM device family that combines high-performance 16nm Virtex UltraScale+ FPGAs with …

Intel’s First FPGAs

They call themselves Intel now.<p>Sure, they still live in the Altera building and the technology is still unmistakably Altera’s, but the company has …

IBM's new AI-friendly server adopts Nvidia's NVLink for faster memory - ExtremeTech

IBM’s new AI-friendly server adopts Nvidia’s NVLink for faster memory<p>By on September 8, 2016 at 1:30 pm<p>This site may earn affiliate commissions from …

Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for …

GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) design and reduce time-to-market for its customers.

GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) design and …

Soitec Bounces Back, Makes Gains in Mobile Phones, Automotive | Siliconica

<i>By Dick James, Senior Technology Analyst, Chipworks</i><p>July 11 – 15 was the week for the annual pilgrimage down to the SEMICON West show, though it’s …

ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of …

本田與大同特殊鋼合力開發不使用稀土重金屬的馬達

Intel launches Broadwell-based Xeons with up to 24 cores, 60MB L3 cache, 3D XPoint - ExtremeTech

By on June 6, 2016 at 4:40 pm<p>This site may earn affiliate commissions from the links on this page. Terms of use.<p>Intel announced a new lineup of …

AMD’s Firepro S7100X is hardware virtualized

AMD is the first to a fully virtualized GPU with their new Firepro S7100X module. If you have been looking for real SR-IOV compliant graphics, AMD’s …

3 Tech Giants Betting on NVIDIA's GPUs

Facebook, Amazon, and Microsoft are using NVIDIA's processors to power the future of tech.<p><b>NVIDIA</b> (NASDAQ:NVDA) is known for its leadership in the …

ARM, Qualcomm, AMD, and more announce CCIX

ARM, Qualcomm, AMD, Xilinx, Huawei, IBM, Mellanox, and Xilinx all agree on CCIX interconnects. In a not coincidental announcement today, the seven …

Google 為 AI 打造了一款專門的處理器

Google 為數據中心開發專屬的硬體並非新鮮事,但這次的卻是為機器學習而設計專門的處理器:Tenser Processing Unit,它將會著重於每秒能完成的工作。Google 形容在 AI 相關的工作上,TPU 的將會比現時使用同樣能量水平的處理器更快十倍的表現。而且他們也為了在寸金尺土的數據中心使用,把 TPU 設計成能放進硬碟槽的外型。有趣的是這 TPU 的威力已經展示於人前了,3 月時 AlphaGo 戰勝人類時所用的處理器正是它。有了 TPU,Google 指人工智慧將能作出更快的思考和預測。相信這款新處理器在正式亮相後,會更多的應用在 Google 各項服務之中,提供更好的使用 …

AMD unveils its own CPU recommendations for Oculus VR - ExtremeTech

By on February 12, 2016 at 2:45 pm<p>This site may earn affiliate commissions from the links on this page. Terms of use.<p>Earlier this week, Oculus opened …

Computer Hardware

Soft Machines claims its cutting-edge VISC CPU cores can outperform Intel, ARM in performance per watt - ExtremeTech

By on February 5, 2016 at 2:27 pm<p>This site may earn affiliate commissions from the links on this page. Terms of use.<p>More than a year ago, we covered …

Tahoe

Samsung 為次世代遊戲圖像卡開發記憶體晶片

Samsung 在開發記憶體產品上素有心得,他們最新的足跡更伸延至 DRAM 種類。他們最新的 HBM2 模組將能提供最高 256GBps(是大寫 B 啊,Byte 的意思)的速度,是現時 DDR5 晶片市市上最快的。Samsung 指這款 20nm 製程的晶片是提供予願意花錢於其產品的伺服器生產商。像是 NVIDIA 和 AMD 就能藉此為其圖像卡產品帶來顯著的效能提升和改善耗電。<p>Samsung 正量產四層 8gb 核心的 4GB 模組,然而他們已經計劃於年底推出 8 層 8GB 的產品。據該公司的描述,他們這款晶片產品相比 GDDR 5 DRAM,將能讓設計師多有 95% 的空間來使用。換 …

Samsung announces mass production of next-generation HBM2 memory - ExtremeTech

By on January 19, 2016 at 1:49 pm<p>This site may earn affiliate commissions from the links on this page. Terms of use.<p>Samsung announced today that it …

Faceted Classification

New Chipworks data sheds light on Apple's iPad Pro processor design - ExtremeTech

New Chipworks data sheds light on Apple’s iPad Pro processor design<p>By on November 30, 2015 at 3:10 pm<p>This site may earn affiliate commissions from …

Qualcomm teams up with Xilinx and Mellanox for servers

Last week Qualcomm, Xilinx, and Mellanox all teamed up for a server announcement. The significance of it is not the hardware shown but the …

Chipworks: Both Samsung and TSMC are making the A9 chip for Apple

And the Samsung version is smaller than the TSMC version.<p>The only thing that most people will need to know about Apple's A9 is that it's a whole lot …

Apple Watch Launch Confirms WiFi and NFC Inside | Siliconica

Screen shot of PCB from Apple Watch – source: Apple film “Introducing Apple Watch”<p>Broadcom BCM4334 die and position on Apple Watch PCB<p>According to …

TSMC Outlines 16nm, 10nm Plans

SAN JOSE, Calif. — Taiwan Semiconductor Manufacturing Company (TSMC) announced plans to roll out a compact, low-power version of its 16nm FinFET …

New Fujitsu heat pipe technology could cool your next smartphone - ExtremeTech

By on March 16, 2015 at 8:15 am<p>This site may earn affiliate commissions from the links on this page. Terms of use.<p>One of the basic technologies that …

Intel Calls for 3D IC

Intel is right: heterogeneous integration enabled by 3D IC "increasingly important part of scaling."<p>At the recent ISSCC Intel presented the following …

Intel 攜全新 Atom 行動晶片登場亮相

在行動領域中,Intel 的反應一直都稱不上快,但在本屆 MWC 上,其新鮮出爐的 Atom X3、X5、X7 晶片終於可以拿來和高通的產品一較高下了。這三款新品覆蓋到了各級市場,其中 X3 瞄準的是 75 美元以下的裝置,而 X5 和 X7 則對應的則是不低於 119 美元的產品。值得一提的是,在 X3 上 Intel 首次成功將 Modem 集成到了 SoC 之中(有 3G 和 LTE 版本),而且它和 X5、X7 都能提供完整的 Windows 支援。這就意味著在 Windows 10 裝置的生產廠商面前,Intel 目前較高通更有優勢。<p>另外,全新的 Atom 晶片都支援 64 位元架構 …

What is behind the fake Qualcomm Snapdragon 810 overheating rumors?

SemiAccurate has been following a massive FUD campaign for a few months and the rabbit hole has led to some interesting places. While chasing down …